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题名: In Situ Growth of Densely Packed Single-Crystal Copper Nanocone Structure Films with Condensate Microdrop Self-Removal Function on Copper Surfaces
作者: Li, H; Zhu, J; Luo, YT; Yu, FF; Fang, JH; Gao, XF(高雪峰)
通讯作者: Gao, XF(高雪峰)
刊名: ADVANCED MATERIALS INTERFACES
发表日期: 2016
DOI: 10.1002/admi.201600362
卷: 3, 期:19
收录类别: SCI
文章类型: 期刊论文
部门归属: 纳米仿生研究部
关键词[WOS]: SUPERHYDROPHOBIC NANOSTRUCTURED SURFACES ; HEAT-TRANSFER PERFORMANCE ; DROPWISE CONDENSATION ; ENHANCED CONDENSATION ; COOPERATING DEVICE ; ELECTRIC-FIELD ; FABRICATION ; ARRAYS ; WATER ; ELECTRODEPOSITION
语种: 英语
JCR小类分区: 二区
WOS记录号: WOS:000386058100001
Citation statistics:
内容类型: 期刊论文
URI标识: http://ir.sinano.ac.cn/handle/332007/4811
Appears in Collections:纳米仿生研究部_高雪峰团队_期刊论文

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Recommended Citation:
Li, H,Zhu, J,Luo, YT,et al. In Situ Growth of Densely Packed Single-Crystal Copper Nanocone Structure Films with Condensate Microdrop Self-Removal Function on Copper Surfaces[J]. ADVANCED MATERIALS INTERFACES,2016,3(19).
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