SINANO OpenIR  > 纳米器件及相关材料研究部  > SONY团队
一种原位等离子体清洗和键合晶片的设备
代盼; 李鹏; 黄寓洋; 何巍; 季莲; 陆书龙:董建荣; 杨辉
2012-09-12
Date Available2012-09-26
Country中国
Abstract本实用新型涉及一种晶片清洗、键合技术,尤其是指一种能高效率完成清洗和键合操作的原位等离子体清洗和键合晶片的设备。这种设备包括真空键合装置(110),还包括等离子体清洗装置,所述等离子体清洗装置与真空键合装置(110)连通。本实用新型的有益效果在于:将等离子体清洗和晶片键合过程并入到同一腔室中实施,同时实现有效、高质量的晶片清洗、去氧化层和键合。使用该技术进行基片键合,可以解决现有基片键合的污染问题,能够实现高性能的键合性能。
Application Date2012-01-09
Patent NumberCN 202434479
Language中文
Application Number201220005989.1
Document Type专利
Identifierhttp://ir.sinano.ac.cn/handle/332007/845
Collection纳米器件及相关材料研究部_SONY团队
Recommended Citation
GB/T 7714
代盼,李鹏,黄寓洋,等. 一种原位等离子体清洗和键合晶片的设备. CN 202434479[P]. 2012-09-12.
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